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Searching for phrase 3D-IC (changed automatically) with no syntactic query expansion in all metadata.

Publication years (Num. hits)
2004 (1) 2005 (1) 2010 (1)
Publication types (Num. hits)
inproceedings(3)
Venues (Conferences, Journals, ...)
ASP-DAC(1) DAC(1) SLIP(1)
Authors
Daesung Lee 0002(1) Deji Akinwande(1) H.-S. Philip Wong(1) Phillip Christie(1) Shinichi Yasuda(1) Shinobu Fujita(1) Viet H. Nguyen(1) Wojciech Maly(1) Xiangyu Chen(1) Yangdong Steve Deng(1)
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Results
Found 3 publication records. Showing 3 according to the selection in the facets
Hits ?▲ Authors Title Venue Year Link Author keywords
1Shinobu Fujita, Shinichi Yasuda, Daesung Lee 0002, Xiangyu Chen, Deji Akinwande, H.-S. Philip Wong Detachable nano-carbon chip with ultra low power. Search on Bibsonomy DAC The full citation details ... 2010 DBLP  DOI  BibTeX  RDF NEMS, ultra-low power, 3D-IC
1Viet H. Nguyen, Phillip Christie The impact of interstratal interconnect density on the performance of three-dimensional integrated circuits. Search on Bibsonomy SLIP The full citation details ... 2005 DBLP  DOI  BibTeX  RDF interstratal interconnect, 3D-IC, system-level
1Yangdong Steve Deng, Wojciech Maly 2.5D system integration: a design driven system implementation schema. Search on Bibsonomy ASP-DAC The full citation details ... 2004 DBLP  DOI  BibTeX  RDF 2.5D System Integration, 3D stacking, 3D-IC
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